MOSCOW, October 12 – RIA Novosti. to create in Russia a technology called “slope” will produce a fundamentally new domestic microelectronics the size of 3-4 times less than usual, told RIA Novosti deputy general director of “instrument-United Corporation “(DIC, is a Rostec) Andrew Chendarov.
” The new technology is based on methods of 3D-integration can increase the functionality of devices per unit area and volume, improve the performance of devices (for example, by reducing the length of the electrical connections) reduce energy consumption of products, reduce their weight and size, “- said Chendarov.
He stressed that the development of the technology, code-named” slope “over and allow to master the production of fundamentally new for the Russian market products in the field of microelectronics in 3-4 times to reduce the weight and size of the devices.
“On the basis of its already established an experimental model of a miniature on-board unit for the spacecraft and aircraft equipment”, – the source said.
The question of creating domestic electronic-component base (ECB) since the imposition of sanctions against Russia is particularly acute. In late September, Russian President Vladimir Putin once again drew the attention of specialists to the fact that the dominance of foreign partners on the market poses risks microelectronics and need to strengthen the capacity of the domestic industry.
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